cve/2017/CVE-2017-18157.md

### [CVE-2017-18157](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2017-18157)
![](https://img.shields.io/static/v1?label=Product&message=Snapdragon%20Automobile%2C%20Snapdragon%20Mobile%2C%20Snapdragon%20Wear&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=CWE416%3A%20Use%20After%20Free&color=brighgreen)

### Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

### POC

#### Reference
- https://www.qualcomm.com/company/product-security/bulletins

#### Github
- https://github.com/ARPSyndicate/cvemon