cve/2019/CVE-2019-2288.md

### [CVE-2019-2288](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2019-2288)
![](https://img.shields.io/static/v1?label=Product&message=Snapdragon%20Auto%2C%20Snapdragon%20Compute%2C%20Snapdragon%20Connectivity%2C%20Snapdragon%20Consumer%20IOT%2C%20Snapdragon%20Industrial%20IOT%2C%20Snapdragon%20Mobile%2C%20Snapdragon%20Voice%20%26%20Music%2C%20Snapdragon%20Wired%20Infrastructure%20and%20Networking&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=Buffer%20Copy%20Without%20Checking%20Size%20of%20Input%20in%20QTEE&color=brighgreen)

### Description

Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130

### POC

#### Reference
- https://www.qualcomm.com/company/product-security/bulletins/november-2019-bulletin

#### Github
No PoCs found on GitHub currently.