cve/2020/CVE-2020-11166.md

19 lines
1.2 KiB
Markdown
Raw Normal View History

2024-05-25 21:48:12 +02:00
### [CVE-2020-11166](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2020-11166)
![](https://img.shields.io/static/v1?label=Product&message=Snapdragon%20Auto%2C%20Snapdragon%20Compute%2C%20Snapdragon%20Connectivity%2C%20Snapdragon%20Consumer%20IOT%2C%20Snapdragon%20Industrial%20IOT%2C%20Snapdragon%20IoT%2C%20Snapdragon%20Mobile%2C%20Snapdragon%20Voice%20%26%20Music%2C%20Snapdragon%20Wearables&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=Buffer%20Over-read%20Issue%20in%20Data%20Modem&color=brighgreen)
### Description
Potential out of bound read exception when UE receives unusually large number of padding octets in the beginning of ROHC header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
### POC
#### Reference
- https://www.qualcomm.com/company/product-security/bulletins/march-2021-bulletin
2024-06-09 00:33:16 +00:00
- https://www.qualcomm.com/company/product-security/bulletins/march-2021-bulletin
2024-05-25 21:48:12 +02:00
#### Github
- https://github.com/TinyNiko/android_bulletin_notes