### [CVE-2016-2063](https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2016-2063)
![](https://img.shields.io/static/v1?label=Product&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Version&message=n%2Fa&color=blue)
![](https://img.shields.io/static/v1?label=Vulnerability&message=n%2Fa&color=brighgreen)

### Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

### POC

#### Reference
No PoCs from references.

#### Github
- https://github.com/thdusdl1219/CVE-Study