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{
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"CVE_data_meta" : {
"ASSIGNER" : "product-security@qualcomm.com" ,
"ID" : "CVE-2022-22090" ,
"STATE" : "PUBLIC"
} ,
"affects" : {
"vendor" : {
"vendor_data" : [
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{
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"product" : {
"product_data" : [
{
"product_name" : "Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile" ,
"version" : {
"version_data" : [
{
"version_value" : "SD 8 Gen1 5G, SD865 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835"
}
]
}
}
]
} ,
"vendor_name" : "Qualcomm, Inc."
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}
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]
}
} ,
"data_format" : "MITRE" ,
"data_type" : "CVE" ,
"data_version" : "4.0" ,
"description" : {
"description_data" : [
{
"lang" : "eng" ,
"value" : "Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile"
}
]
} ,
"impact" : {
"cvss" : {
"baseScore" : 8.4 ,
"vectorString" : "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H" ,
"version" : "3.1"
}
} ,
"problemtype" : {
"problemtype_data" : [
{
"description" : [
{
"lang" : "eng" ,
"value" : "Use After Free in Audio"
}
]
}
]
} ,
"references" : {
"reference_data" : [
{
"name" : "https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin" ,
"refsource" : "CONFIRM" ,
"url" : "https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin"
}
]
}
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}