cvelist/2020/11xxx/CVE-2020-11205.json

62 lines
2.0 KiB
JSON
Raw Normal View History

2020-03-31 12:02:01 +00:00
{
2020-11-12 15:26:05 +05:30
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2020-11205",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
2020-03-31 12:02:01 +00:00
{
2020-11-12 15:26:05 +05:30
"product": {
"product_data": [
{
"product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile",
"version": {
"version_data": [
{
"version_value": "QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
2020-03-31 12:02:01 +00:00
}
2020-11-12 15:26:05 +05:30
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P"
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Integer Overflow or Wraparound issues in Bluetooth SOC"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin"
}
]
}
2020-03-31 12:02:01 +00:00
}