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{
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"CVE_data_meta" : {
"ASSIGNER" : "product-security@qualcomm.com" ,
"ID" : "CVE-2017-18297" ,
"STATE" : "PUBLIC"
} ,
"affects" : {
"vendor" : {
"vendor_data" : [
{
"product" : {
"product_data" : [
{
"product_name" : "Snapdragon Mobile" ,
"version" : {
"version_data" : [
{
"version_value" : "SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820"
}
]
}
}
]
} ,
"vendor_name" : "Qualcomm, Inc."
}
]
}
} ,
"data_format" : "MITRE" ,
"data_type" : "CVE" ,
"data_version" : "4.0" ,
"description" : {
"description_data" : [
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{
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"lang" : "eng" ,
"value" : "Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820."
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}
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]
} ,
"problemtype" : {
"problemtype_data" : [
{
"description" : [
{
"lang" : "eng" ,
"value" : "Double Free in Trusted Application Environment"
}
]
}
]
} ,
"references" : {
"reference_data" : [
{
"name" : "https://www.qualcomm.com/company/product-security/bulletins" ,
"refsource" : "CONFIRM" ,
"url" : "https://www.qualcomm.com/company/product-security/bulletins"
} ,
{
"name" : "1041432" ,
"refsource" : "SECTRACK" ,
"url" : "http://www.securitytracker.com/id/1041432"
} ,
{
"name" : "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components" ,
"refsource" : "CONFIRM" ,
"url" : "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"
}
]
}
}