{ "CVE_data_meta": { "ASSIGNER": "product-security@qualcomm.com", "ID": "CVE-2021-35077", "STATE": "PUBLIC" }, "affects": { "vendor": { "vendor_data": [ { "product": { "product_data": [ { "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile", "version": { "version_data": [ { "version_value": "AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, QRB5165, QRB5165M, QRB5165N, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD 8 Gen1 5G, SD460, SD480, SD662, SD690 5G, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD865 5G, SD870, SD888, SD888 5G, SDX12, SDX55M, SDX65, SM6225, SM6375, SM7250P, SM7315, SM7325P, WCD9335, WCD9370, WCD9375, WCD9380, WCD9385, WCN3910, WCN3950, WCN3988, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835" } ] } } ] }, "vendor_name": "Qualcomm, Inc." } ] } }, "data_format": "MITRE", "data_type": "CVE", "data_version": "4.0", "description": { "description_data": [ { "lang": "eng", "value": "Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile" } ] }, "impact": { "cvss": { "baseScore": 8.4, "vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "version": "3.1" } }, "problemtype": { "problemtype_data": [ { "description": [ { "lang": "eng", "value": "Use After Free in DSP Services" } ] } ] }, "references": { "reference_data": [ { "name": "https://www.qualcomm.com/company/product-security/bulletins/february-2022-bulletin", "refsource": "CONFIRM", "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2022-bulletin" } ] } }