{
   "CVE_data_meta": {
      "ASSIGNER": "product-security@qualcomm.com",
      "ID": "CVE-2019-14122",
      "STATE": "PUBLIC"
   },
   "affects": {
      "vendor": {
         "vendor_data": [
            {
               "product": {
                  "product_data": [
                     {
                        "product_name": "Snapdragon Auto, Snapdragon Mobile",
                        "version": {
                           "version_data": [
                              {
                                 "version_value": "Saipan, SM8150, SM8250, SXR2130"
                              }
                           ]
                        }
                     }
                  ]
               },
               "vendor_name": "Qualcomm, Inc."
            }
         ]
      }
   },
   "data_format": "MITRE",
   "data_type": "CVE",
   "data_version": "4.0",
   "description": {
      "description_data": [
         {
            "lang": "eng",
            "value": "Memory failure in SKB if it fails to to add the requested padding to the skb in low memory targets or targets with major memory fragmentation in Snapdragon Auto, Snapdragon Mobile in Saipan, SM8150, SM8250, SXR2130"
         }
      ]
   },
   "problemtype": {
      "problemtype_data": [
         {
            "description": [
               {
                  "lang": "eng",
                  "value": "Detection of Error Condition without Action in Qualcomm IPC"
               }
            ]
         }
      ]
   },
   "references": {
      "reference_data": [
         {
            "name": "https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin",
            "refsource": "CONFIRM",
            "url": "https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin"
         }
      ]
   }
}