{ "CVE_data_meta": { "ASSIGNER": "product-security@qualcomm.com", "ID": "CVE-2022-22105", "STATE": "PUBLIC" }, "affects": { "vendor": { "vendor_data": [ { "product": { "product_data": [ { "product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music", "version": { "version_data": [ { "version_value": "APQ8009, APQ8017, APQ8053, APQ8096AU, AR8031, CSRA6620, CSRA6640, CSRB31024, MDM9150, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, QCA4020, QCA6174A, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6595, QCA6595AU, QCA6696, QCA9367, QCA9377, QCA9379, QCS405, SA415M, SA515M, SA6155, SA6155P, SA8155, SA8155P, SA8195P, SDX20, SDX55, WCD9326, WCD9335, WCD9360, WCN3610, WCN3615, WCN3660B, WCN3680B, WCN3980, WCN3998, WCN3999, WSA8810, WSA8815" } ] } } ] }, "vendor_name": "Qualcomm, Inc." } ] } }, "data_format": "MITRE", "data_type": "CVE", "data_version": "4.0", "description": { "description_data": [ { "lang": "eng", "value": "Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music" } ] }, "impact": { "cvss": { "baseScore": 9.4, "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:L", "version": "3.1" } }, "problemtype": { "problemtype_data": [ { "description": [ { "lang": "eng", "value": "Integer Overflow or Wraparound in Automotive Connectivity" } ] } ] }, "references": { "reference_data": [ { "name": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin", "refsource": "CONFIRM", "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin" } ] } }