{
    "CVE_data_meta": {
        "ASSIGNER": "product-security@qualcomm.com",
        "ID": "CVE-2018-11976",
        "STATE": "PUBLIC"
    },
    "affects": {
        "vendor": {
            "vendor_data": [
                {
                    "product": {
                        "product_data": [
                            {
                                "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking",
                                "version": {
                                    "version_data": [
                                        {
                                            "version_value": "IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130"
                                        }
                                    ]
                                }
                            }
                        ]
                    },
                    "vendor_name": "Qualcomm, Inc."
                }
            ]
        }
    },
    "data_format": "MITRE",
    "data_type": "CVE",
    "data_version": "4.0",
    "description": {
        "description_data": [
            {
                "lang": "eng",
                "value": "ECDSA signature code leaks private keys from secure world to non-secure world in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130"
            }
        ]
    },
    "problemtype": {
        "problemtype_data": [
            {
                "description": [
                    {
                        "lang": "eng",
                        "value": "Cryptographic issue in ECDSA signature Code"
                    }
                ]
            }
        ]
    },
    "references": {
        "reference_data": [
            {
                "name": "https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-11976",
                "refsource": "CONFIRM",
                "url": "https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-11976"
            }
        ]
    }
}