cvelist/2022/33xxx/CVE-2022-33217.json

{
   "CVE_data_meta": {
      "ASSIGNER": "product-security@qualcomm.com", 
      "ID": "CVE-2022-33217", 
      "STATE": "PUBLIC"
   }, 
   "affects": {
      "vendor": {
         "vendor_data": [
            {
               "product": {
                  "product_data": [
                     {
                        "product_name": "Snapdragon Mobile", 
                        "version": {
                           "version_data": [
                              {
                                 "version_value": "SD 8 Gen1 5G, WCD9380, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8835"
                              }
                           ]
                        }
                     }
                  ]
               }, 
               "vendor_name": "Qualcomm, Inc."
            }
         ]
      }
   }, 
   "data_format": "MITRE", 
   "data_type": "CVE", 
   "data_version": "4.0", 
   "description": {
      "description_data": [
         {
            "lang": "eng", 
            "value": "Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile"
         }
      ]
   }, 
   "impact": {
      "cvss": {
         "baseScore": 7.8, 
         "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", 
         "version": "3.1"
      }
   }, 
   "problemtype": {
      "problemtype_data": [
         {
            "description": [
               {
                  "lang": "eng", 
                  "value": "Buffer copy without checking size of input in Qualcomm IPC"
               }
            ]
         }
      ]
   }, 
   "references": {
      "reference_data": [
         {
            "name": "https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin", 
            "refsource": "CONFIRM", 
            "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin"
         }
      ]
   }
}