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cvelist/2022/33xxx/CVE-2022-33269.json
CVE Team 551385a07c
"-Synchronized-Data."
2024-04-12 17:00:35 +00:00

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{
"data_version": "4.0",
"data_type": "CVE",
"data_format": "MITRE",
"CVE_data_meta": {
"ID": "CVE-2022-33269",
"ASSIGNER": "product-security@qualcomm.com",
"STATE": "PUBLIC"
},
"description": {
"description_data": [
{
"lang": "eng",
"value": "Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment."
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "CWE-190 Integer Overflow or Wraparound",
"cweId": "CWE-190"
}
]
}
]
},
"affects": {
"vendor": {
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{
"vendor_name": "Qualcomm, Inc.",
"product": {
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]
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}
]
}
}
]
}
},
"references": {
"reference_data": [
{
"url": "https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin",
"refsource": "MISC",
"name": "https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin"
}
]
},
"impact": {
"cvss": [
{
"attackComplexity": "LOW",
"attackVector": "LOCAL",
"availabilityImpact": "HIGH",
"baseScore": 9.3,
"baseSeverity": "CRITICAL",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"privilegesRequired": "NONE",
"scope": "CHANGED",
"userInteraction": "NONE",
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H",
"version": "3.1"
}
]
}
}
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