mirror of
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72 lines
2.6 KiB
JSON
72 lines
2.6 KiB
JSON
{
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"CVE_data_meta": {
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"ASSIGNER": "cve@mitre.org",
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"ID": "CVE-2016-2063",
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"STATE": "PUBLIC"
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},
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"affects": {
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"vendor": {
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"vendor_data": [
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{
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"product": {
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"product_data": [
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{
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"product_name": "n/a",
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"version": {
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"version_data": [
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{
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"version_value": "n/a"
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}
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]
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}
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}
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]
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},
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"vendor_name": "n/a"
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}
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]
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}
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},
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"data_format": "MITRE",
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"data_type": "CVE",
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"data_version": "4.0",
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"description": {
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"description_data": [
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{
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"lang": "eng",
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"value": "Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface."
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}
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]
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},
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"problemtype": {
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"problemtype_data": [
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{
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"description": [
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{
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"lang": "eng",
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"value": "n/a"
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}
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]
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}
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]
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},
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"references": {
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"reference_data": [
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{
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"name": "92381",
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"refsource": "BID",
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"url": "http://www.securityfocus.com/bid/92381"
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},
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{
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"name": "https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4",
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"refsource": "CONFIRM",
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"url": "https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4"
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},
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{
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"name": "https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063",
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"refsource": "CONFIRM",
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"url": "https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063"
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}
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]
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}
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} |