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72 lines
2.6 KiB
JSON
72 lines
2.6 KiB
JSON
{
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"CVE_data_meta": {
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"ASSIGNER": "product-security@qualcomm.com",
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"ID": "CVE-2020-11208",
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"STATE": "PUBLIC"
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},
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"affects": {
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"vendor": {
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"vendor_data": [
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{
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"product": {
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"product_data": [
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{
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"product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile",
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"version": {
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"version_data": [
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{
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"version_value": "SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439"
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}
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]
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}
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}
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]
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},
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"vendor_name": "Qualcomm, Inc."
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}
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]
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}
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},
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"data_format": "MITRE",
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"data_type": "CVE",
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"data_version": "4.0",
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"description": {
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"description_data": [
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{
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"lang": "eng",
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"value": "Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439"
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}
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]
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},
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"problemtype": {
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"problemtype_data": [
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{
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"description": [
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{
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"lang": "eng",
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"value": "Buffer Overflow in DSP Process"
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}
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]
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}
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]
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},
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"references": {
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"reference_data": [
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{
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"name": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin",
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"refsource": "CONFIRM",
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"url": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin"
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},
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{
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"refsource": "MISC",
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"name": "https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/",
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"url": "https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/"
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},
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{
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"refsource": "MISC",
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"name": "https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/",
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"url": "https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/"
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}
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]
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}
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} |