cvelist/2020/11xxx/CVE-2020-11205.json
2020-11-12 15:26:05 +05:30

62 lines
2.0 KiB
JSON

{
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2020-11205",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile",
"version": {
"version_data": [
{
"version_value": "QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P"
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Integer Overflow or Wraparound issues in Bluetooth SOC"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin"
}
]
}
}