cvelist/2021/30xxx/CVE-2021-30315.json

{
   "CVE_data_meta": {
      "ASSIGNER": "product-security@qualcomm.com",
      "ID": "CVE-2021-30315",
      "STATE": "PUBLIC"
   },
   "affects": {
      "vendor": {
         "vendor_data": [
            {
               "product": {
                  "product_data": [
                     {
                        "product_name": "Snapdragon Auto",
                        "version": {
                           "version_data": [
                              {
                                 "version_value": "MDM9628, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6155, SA6155P, SA8150P, SA8155, SA8155P, SA8195P"
                              }
                           ]
                        }
                     }
                  ]
               },
               "vendor_name": "Qualcomm, Inc."
            }
         ]
      }
   },
   "data_format": "MITRE",
   "data_type": "CVE",
   "data_version": "4.0",
   "description": {
      "description_data": [
         {
            "lang": "eng",
            "value": "Improper handling of sensor HAL structure in absence of sensor can lead to use after free in Snapdragon Auto"
         }
      ]
   },
   "impact": {
      "cvss": {
         "baseScore": 8.4,
         "vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
         "version": "3.1"
      }
   },
   "problemtype": {
      "problemtype_data": [
         {
            "description": [
               {
                  "lang": "eng",
                  "value": "Use After Free in Sensor Hardware Abstraction Layer"
               }
            ]
         }
      ]
   },
   "references": {
      "reference_data": [
         {
            "name": "https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin",
            "refsource": "CONFIRM",
            "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2021-bulletin"
         }
      ]
   }
}