cvelist/2017/18xxx/CVE-2017-18140.json
2019-03-17 22:53:43 +00:00

68 lines
2.6 KiB
JSON

{
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"DATE_PUBLIC": "2018-04-02T00:00:00",
"ID": "CVE-2017-18140",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
"version": {
"version_data": [
{
"version_value": "MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur."
}
]
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Use After Free in Data"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://source.android.com/security/bulletin/2018-04-01",
"refsource": "CONFIRM",
"url": "https://source.android.com/security/bulletin/2018-04-01"
},
{
"name": "103671",
"refsource": "BID",
"url": "http://www.securityfocus.com/bid/103671"
}
]
}
}