cvelist/2022/25xxx/CVE-2022-25693.json
2022-09-16 10:53:30 +05:30

69 lines
2.0 KiB
JSON

{
"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2022-25693",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"product": {
"product_data": [
{
"product_name": "Snapdragon Connectivity, Snapdragon Mobile",
"version": {
"version_data": [
{
"version_value": "SD 8 Gen1 5G, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
}
]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "Memory corruption in graphics due to use-after-free while graphics profiling in Snapdragon Connectivity, Snapdragon Mobile"
}
]
},
"impact": {
"cvss": {
"baseScore": 8.4,
"vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
"version": "3.1"
}
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Use After Free in Graphics"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin"
}
]
}
}