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nvd-json-data-feeds/CVE-2022/CVE-2022-256xx/CVE-2022-25677.json

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{
"id": "CVE-2022-25677",
"sourceIdentifier": "product-security@qualcomm.com",
"published": "2022-12-13T16:15:17.870",
"lastModified": "2022-12-15T16:49:27.473",
"vulnStatus": "Analyzed",
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{
"lang": "en",
"value": "Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking"
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},
{
"lang": "es",
"value": "Corrupci\u00f3n de la memoria en diagn\u00f3stico debido al use-after-free mientras se procesa el paquete dci en Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking"
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"references": [
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"source": "product-security@qualcomm.com",
"tags": [
"Patch",
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]
}
]
}
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