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nvd-json-data-feeds/CVE-2017/CVE-2017-182xx/CVE-2017-18295.json

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{
"id": "CVE-2017-18295",
"sourceIdentifier": "product-security@qualcomm.com",
"published": "2018-10-23T13:29:01.523",
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"lastModified": "2024-11-21T03:19:47.733",
"vulnStatus": "Modified",
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"cveTags": [],
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"descriptions": [
{
"lang": "en",
"value": "Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20."
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"lang": "es",
"value": "Posible desbordamiento de b\u00fafer si la entrada no est\u00e1 acabada en null en el m\u00f3dulo del servicio DSP en Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear en la versi\u00f3n MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835 y SDX20."
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"baseScore": 7.8,
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"attackVector": "LOCAL",
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},
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}
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