{
  "id": "CVE-2022-1602",
  "sourceIdentifier": "hp-security-alert@hp.com",
  "published": "2022-09-13T15:15:08.400",
  "lastModified": "2024-11-21T06:41:03.383",
  "vulnStatus": "Modified",
  "cveTags": [],
  "descriptions": [
    {
      "lang": "en",
      "value": "A potential security vulnerability has been identified in HP ThinPro 7.2 Service Pack 8 (SP8). The security vulnerability in SP8 is not remedied after upgrading from SP8 to Service Pack 9 (SP9). HP has released Service Pack 10 (SP10) to remediate the potential vulnerability introduced in SP8."
    },
    {
      "lang": "es",
      "value": "Se ha identificado una posible vulnerabilidad de seguridad en HP ThinPro versi\u00f3n 7.2 Service Pack 8 (SP8). La vulnerabilidad de seguridad en el SP8 no es mitigada despu\u00e9s de actualizar del SP8 al Service Pack 9 (SP9). HP ha lanzado el Service Pack 10 (SP10) para mitigar la posible vulnerabilidad introducida en el SP8"
    }
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          "baseScore": 5.5,
          "baseSeverity": "MEDIUM",
          "attackVector": "LOCAL",
          "attackComplexity": "LOW",
          "privilegesRequired": "LOW",
          "userInteraction": "NONE",
          "scope": "UNCHANGED",
          "confidentialityImpact": "NONE",
          "integrityImpact": "HIGH",
          "availabilityImpact": "NONE"
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      "source": "hp-security-alert@hp.com",
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