{
  "id": "CVE-2023-43516",
  "sourceIdentifier": "product-security@qualcomm.com",
  "published": "2024-02-06T06:16:01.307",
  "lastModified": "2024-02-09T00:50:24.280",
  "vulnStatus": "Analyzed",
  "descriptions": [
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      "lang": "en",
      "value": "Memory corruption when malformed message payload is received from firmware."
    },
    {
      "lang": "es",
      "value": "Corrupci\u00f3n de la memoria cuando se recibe un payload de mensajes con formato incorrecto desde el firmware."
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          "attackVector": "LOCAL",
          "attackComplexity": "LOW",
          "privilegesRequired": "LOW",
          "userInteraction": "NONE",
          "scope": "UNCHANGED",
          "confidentialityImpact": "HIGH",
          "integrityImpact": "HIGH",
          "availabilityImpact": "HIGH",
          "baseScore": 7.8,
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  "references": [
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      "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin",
      "source": "product-security@qualcomm.com",
      "tags": [
        "Vendor Advisory"
      ]
    }
  ]
}