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64 lines
1.9 KiB
JSON
64 lines
1.9 KiB
JSON
{
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"id": "CVE-2024-43047",
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"sourceIdentifier": "product-security@qualcomm.com",
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"published": "2024-10-07T13:15:15.257",
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"lastModified": "2024-10-09T01:00:01.157",
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"vulnStatus": "Awaiting Analysis",
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"cveTags": [],
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"cisaExploitAdd": "2024-10-08",
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"cisaActionDue": "2024-10-29",
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"cisaRequiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
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"cisaVulnerabilityName": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
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"descriptions": [
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{
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"lang": "en",
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"value": "Memory corruption while maintaining memory maps of HLOS memory."
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},
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{
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"lang": "es",
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"value": "Corrupci\u00f3n de memoria mientras se mantienen los mapas de memoria de la memoria HLOS."
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}
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],
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"metrics": {
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"cvssMetricV31": [
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{
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"source": "product-security@qualcomm.com",
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"type": "Primary",
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"cvssData": {
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"version": "3.1",
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"vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
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"attackVector": "LOCAL",
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"attackComplexity": "LOW",
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"privilegesRequired": "LOW",
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"userInteraction": "NONE",
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"scope": "UNCHANGED",
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"confidentialityImpact": "HIGH",
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"integrityImpact": "HIGH",
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"availabilityImpact": "HIGH",
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"baseScore": 7.8,
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"baseSeverity": "HIGH"
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},
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"exploitabilityScore": 1.8,
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"impactScore": 5.9
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}
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]
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},
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"weaknesses": [
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{
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"source": "product-security@qualcomm.com",
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"type": "Secondary",
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"description": [
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{
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"lang": "en",
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"value": "CWE-416"
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}
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]
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}
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],
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"references": [
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{
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"url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/october-2024-bulletin.html",
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"source": "product-security@qualcomm.com"
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}
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]
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} |