mirror of
https://github.com/fkie-cad/nvd-json-data-feeds.git
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359 lines
9.5 KiB
JSON
359 lines
9.5 KiB
JSON
{
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"id": "CVE-2018-11824",
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"sourceIdentifier": "product-security@qualcomm.com",
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"published": "2018-10-26T13:29:01.027",
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"lastModified": "2020-08-24T17:37:01.140",
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"vulnStatus": "Analyzed",
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"descriptions": [
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{
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"lang": "en",
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"value": "A stack-based buffer overflow can occur in a firmware routine in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, SDA660"
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},
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{
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"lang": "es",
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"value": "Puede ocurrir un desbordamiento de b\u00fafer basado en pila en una rutina del firmware en Snapdragon Mobile y Snapdragon Wear en versiones MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850 y SDA660."
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}
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],
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"type": "Primary",
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"cvssData": {
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"version": "3.0",
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"vectorString": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
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"attackVector": "LOCAL",
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"attackComplexity": "LOW",
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"privilegesRequired": "LOW",
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"userInteraction": "NONE",
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"scope": "UNCHANGED",
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"confidentialityImpact": "HIGH",
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"integrityImpact": "HIGH",
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"baseScore": 7.8,
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"accessComplexity": "LOW",
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"authentication": "NONE",
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"confidentialityImpact": "COMPLETE",
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"baseScore": 7.2
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"references": [
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{
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"url": "https://www.qualcomm.com/company/product-security/bulletins",
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"source": "product-security@qualcomm.com",
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"tags": [
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} |