mirror of
https://github.com/fkie-cad/nvd-json-data-feeds.git
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413 lines
11 KiB
JSON
413 lines
11 KiB
JSON
{
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"id": "CVE-2018-5878",
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"sourceIdentifier": "product-security@qualcomm.com",
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"published": "2018-07-06T17:29:01.710",
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"lastModified": "2018-09-10T17:50:09.937",
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"vulnStatus": "Analyzed",
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"descriptions": [
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{
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"lang": "en",
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"value": "While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear."
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},
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{
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"lang": "es",
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"value": "Al enviar la respuesta a un mensaje RIL_REQUEST_GET_SMSC_ADDRESS, podr\u00eda ocurrir un desbordamiento de b\u00fafer en Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear."
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}
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],
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"cvssData": {
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"version": "3.0",
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"vectorString": "CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
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"attackVector": "NETWORK",
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"attackComplexity": "LOW",
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"privilegesRequired": "NONE",
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"userInteraction": "NONE",
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"scope": "UNCHANGED",
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"confidentialityImpact": "HIGH",
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"integrityImpact": "HIGH",
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"baseScore": 9.8,
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"baseSeverity": "CRITICAL"
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"accessVector": "NETWORK",
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"accessComplexity": "LOW",
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"authentication": "NONE",
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"confidentialityImpact": "PARTIAL",
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"integrityImpact": "PARTIAL",
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"availabilityImpact": "PARTIAL",
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"baseScore": 7.5
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},
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"baseSeverity": "HIGH",
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"exploitabilityScore": 10.0,
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"impactScore": 6.4,
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"references": [
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{
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"url": "https://www.qualcomm.com/company/product-security/bulletins",
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"source": "product-security@qualcomm.com",
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"tags": [
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