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2023-05-16 16:09:41 +02:00

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{
"id": "CVE-2016-2063",
"sourceIdentifier": "cve@mitre.org",
"published": "2016-08-07T21:59:04.987",
"lastModified": "2020-08-06T18:24:18.100",
"vulnStatus": "Analyzed",
"descriptions": [
{
"lang": "en",
"value": "Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface."
},
{
"lang": "es",
"value": "Desbordamiento de b\u00fafer basado en pila en la funci\u00f3n supply_lm_input_write en drivers/thermal/supply_lm_core.c en el controlador MSM Thermal para el kernel de Linux 3.x, como se usa en contribuciones Qualcomm Innovation Center (QuIC) Android para dispositivos MSM y otros productos, permite a atacantes provocar una denegaci\u00f3n de servicio o posiblemente tener otro impacto no especificado a trav\u00e9s de a aplicaci\u00f3n manipulada que env\u00eda una gran cantidad de datos a trav\u00e9s de la interfaz debugfs."
}
],
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"attackVector": "LOCAL",
"attackComplexity": "LOW",
"privilegesRequired": "LOW",
"userInteraction": "NONE",
"scope": "UNCHANGED",
"confidentialityImpact": "HIGH",
"integrityImpact": "HIGH",
"availabilityImpact": "HIGH",
"baseScore": 7.8,
"baseSeverity": "HIGH"
},
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}
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"baseScore": 4.6
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"exploitabilityScore": 3.9,
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"source": "cve@mitre.org",
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