nvd-json-data-feeds/CVE-2019/CVE-2019-206xx/CVE-2019-20607.json

{
  "id": "CVE-2019-20607",
  "sourceIdentifier": "cve@mitre.org",
  "published": "2020-03-24T20:15:13.553",
  "lastModified": "2024-11-21T04:38:51.867",
  "vulnStatus": "Modified",
  "cveTags": [],
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    {
      "lang": "en",
      "value": "An issue was discovered on Samsung mobile devices with N(7.x), O(8.x), and P(9.0) (MSM8996, MSM8998, Exynos7420, Exynos7870, Exynos8890, and Exynos8895 chipsets) software. A heap overflow in the keymaster Trustlet allows attackers to write to TEE memory, and achieve arbitrary code execution. The Samsung ID is SVE-2019-14126 (May 2019)."
    },
    {
      "lang": "es",
      "value": "Se detect\u00f3 un problema en dispositivos m\u00f3viles Samsung con versiones de software N(7.x), O(8.x) y P(9.0) (MSM8996, MSM8998, Exynos7420, Exynos7870, Exynos8890 y Exynos8895). Un desbordamiento de pila (heap) en el keymaster Trustlet permite a atacantes escribir en la memoria TEE y lograr una ejecuci\u00f3n de c\u00f3digo arbitrario. El ID de Samsung es SVE-2019-14126 (Mayo de 2019)."
    }
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