nvd-json-data-feeds/CVE-2022/CVE-2022-332xx/CVE-2022-33217.json

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  "id": "CVE-2022-33217",
  "sourceIdentifier": "product-security@qualcomm.com",
  "published": "2022-10-19T11:15:11.110",
  "lastModified": "2024-11-21T07:07:44.960",
  "vulnStatus": "Modified",
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      "value": "Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile"
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      "lang": "es",
      "value": "Una corrupci\u00f3n de memoria en Qualcomm IPC debido a una copia del b\u00fafer sin comprobar el tama\u00f1o de la entrada mientras es iniciada la comunicaci\u00f3n con un kernel comprometido. en Snapdragon Mobile"
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      "url": "https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin",
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