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nvd-json-data-feeds/CVE-2020/CVE-2020-36xx/CVE-2020-3629.json
cad-safe-bot 9d8babeec3 Auto-Update: 2024-07-14T02:00:17.787041+00:00
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{
"id": "CVE-2020-3629",
"sourceIdentifier": "product-security@qualcomm.com",
"published": "2020-09-08T10:15:15.327",
"lastModified": "2020-09-14T15:37:32.697",
"vulnStatus": "Analyzed",
"cveTags": [],
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{
"lang": "en",
"value": "u'Stack out of bound issue occurs when making query to DSP capabilities due to wrong assumption was made on determining the buffer size for the DSP attributes' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in Bitra, Kamorta, Rennell, SC7180, SDM845, SM6150, SM7150, SM8150, SM8250, SXR2130"
},
{
"lang": "es",
"value": "Un problema fuera del l\u00edmite de la pila ocurre cuando se realizan consultas a las capacidades de DSP debido a que una suposici\u00f3n err\u00f3nea fue hecha al determinar el tama\u00f1o del b\u00fafer para los atributos de DSP en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones Bitra, Kamorta, Rennell, SC7180, SDM845, SM6150, SM7150, SM8150, SM8250, SXR2130."
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"attackComplexity": "LOW",
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"userInteraction": "NONE",
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}
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