2024-12-08 03:06:42 +00:00

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{
"id": "CVE-2017-18313",
"sourceIdentifier": "product-security@qualcomm.com",
"published": "2018-10-23T13:29:02.837",
"lastModified": "2024-11-21T03:19:50.010",
"vulnStatus": "Modified",
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"value": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617."
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"value": "En ciertos modos de operaciones, HLOS podr\u00eda ser capaz de obtener acceso directo o indirecto mediante los canales DXE para manipular el firmware WCNSS autenticado almacenado en DDR debido a que la memoria DXE accesible se ubica en la imagen autenticada en Snapdragon Mobile y Snapdragon Wear en versiones MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415 y SD 617."
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