2018-02-05 15:02:15 -05:00
|
|
|
{
|
2019-05-06 23:00:44 +00:00
|
|
|
"data_type": "CVE",
|
|
|
|
"data_format": "MITRE",
|
|
|
|
"data_version": "4.0",
|
2019-03-17 21:57:39 +00:00
|
|
|
"CVE_data_meta": {
|
|
|
|
"ID": "CVE-2017-18157",
|
2019-05-06 23:00:44 +00:00
|
|
|
"ASSIGNER": "product-security@qualcomm.com",
|
|
|
|
"STATE": "PUBLIC"
|
|
|
|
},
|
|
|
|
"affects": {
|
|
|
|
"vendor": {
|
|
|
|
"vendor_data": [
|
|
|
|
{
|
|
|
|
"vendor_name": "Qualcomm Technologies, Inc.",
|
|
|
|
"product": {
|
|
|
|
"product_data": [
|
|
|
|
{
|
|
|
|
"product_name": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
|
|
|
|
"version": {
|
|
|
|
"version_data": [
|
|
|
|
{
|
|
|
|
"version_value": "MDM9206"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "MDM9607"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "MDM9650"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "MSM8909W"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "MSM8996AU"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 210/SD 212/SD 205"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 425"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 450"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 615/16/SD 415"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 625"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 650/52"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 820"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 820A"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 835"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SD 845"
|
|
|
|
},
|
|
|
|
{
|
|
|
|
"version_value": "SDX20"
|
|
|
|
}
|
|
|
|
]
|
|
|
|
}
|
|
|
|
}
|
|
|
|
]
|
|
|
|
}
|
|
|
|
}
|
|
|
|
]
|
|
|
|
}
|
|
|
|
},
|
|
|
|
"problemtype": {
|
|
|
|
"problemtype_data": [
|
|
|
|
{
|
|
|
|
"description": [
|
|
|
|
{
|
|
|
|
"lang": "eng",
|
|
|
|
"value": "CWE416: Use After Free"
|
|
|
|
}
|
|
|
|
]
|
|
|
|
}
|
|
|
|
]
|
|
|
|
},
|
|
|
|
"references": {
|
|
|
|
"reference_data": [
|
|
|
|
{
|
|
|
|
"refsource": "CONFIRM",
|
|
|
|
"name": "https://www.qualcomm.com/company/product-security/bulletins",
|
|
|
|
"url": "https://www.qualcomm.com/company/product-security/bulletins"
|
|
|
|
}
|
|
|
|
]
|
2019-03-17 21:57:39 +00:00
|
|
|
},
|
|
|
|
"description": {
|
|
|
|
"description_data": [
|
|
|
|
{
|
|
|
|
"lang": "eng",
|
2019-05-06 23:00:44 +00:00
|
|
|
"value": "A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20."
|
2019-03-17 21:57:39 +00:00
|
|
|
}
|
|
|
|
]
|
|
|
|
}
|
|
|
|
}
|