cvelist/2017/18xxx/CVE-2017-18157.json
2019-05-06 23:00:44 +00:00

107 lines
4.3 KiB
JSON

{
"data_type": "CVE",
"data_format": "MITRE",
"data_version": "4.0",
"CVE_data_meta": {
"ID": "CVE-2017-18157",
"ASSIGNER": "product-security@qualcomm.com",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
{
"vendor_name": "Qualcomm Technologies, Inc.",
"product": {
"product_data": [
{
"product_name": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
"version": {
"version_data": [
{
"version_value": "MDM9206"
},
{
"version_value": "MDM9607"
},
{
"version_value": "MDM9650"
},
{
"version_value": "MSM8909W"
},
{
"version_value": "MSM8996AU"
},
{
"version_value": "SD 210/SD 212/SD 205"
},
{
"version_value": "SD 425"
},
{
"version_value": "SD 450"
},
{
"version_value": "SD 615/16/SD 415"
},
{
"version_value": "SD 625"
},
{
"version_value": "SD 650/52"
},
{
"version_value": "SD 820"
},
{
"version_value": "SD 820A"
},
{
"version_value": "SD 835"
},
{
"version_value": "SD 845"
},
{
"version_value": "SDX20"
}
]
}
}
]
}
}
]
}
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "CWE416: Use After Free"
}
]
}
]
},
"references": {
"reference_data": [
{
"refsource": "CONFIRM",
"name": "https://www.qualcomm.com/company/product-security/bulletins",
"url": "https://www.qualcomm.com/company/product-security/bulletins"
}
]
},
"description": {
"description_data": [
{
"lang": "eng",
"value": "A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20."
}
]
}
}