cvelist/2022/22xxx/CVE-2022-22105.json

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{
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"CVE_data_meta": {
"ASSIGNER": "product-security@qualcomm.com",
"ID": "CVE-2022-22105",
"STATE": "PUBLIC"
},
"affects": {
"vendor": {
"vendor_data": [
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{
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"product": {
"product_data": [
{
"product_name": "Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music",
"version": {
"version_data": [
{
"version_value": "APQ8009, APQ8017, APQ8053, APQ8096AU, AR8031, CSRA6620, CSRA6640, CSRB31024, MDM9150, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, QCA4020, QCA6174A, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6595, QCA6595AU, QCA6696, QCA9367, QCA9377, QCA9379, QCS405, SA415M, SA515M, SA6155, SA6155P, SA8155, SA8155P, SA8195P, SDX20, SDX55, WCD9326, WCD9335, WCD9360, WCN3610, WCN3615, WCN3660B, WCN3680B, WCN3980, WCN3998, WCN3999, WSA8810, WSA8815"
}
]
}
}
]
},
"vendor_name": "Qualcomm, Inc."
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}
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]
}
},
"data_format": "MITRE",
"data_type": "CVE",
"data_version": "4.0",
"description": {
"description_data": [
{
"lang": "eng",
"value": "Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music"
}
]
},
"impact": {
"cvss": {
"baseScore": 9.4,
"vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:L",
"version": "3.1"
}
},
"problemtype": {
"problemtype_data": [
{
"description": [
{
"lang": "eng",
"value": "Integer Overflow or Wraparound in Automotive Connectivity"
}
]
}
]
},
"references": {
"reference_data": [
{
"name": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin",
"refsource": "CONFIRM",
"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin"
}
]
}
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}